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Ziitek Thermal Conductive Materials & Technology Ltd Professional TIM Manufacturer
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Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness

Dongguan Ziitek Electronic Materials & Technology Ltd.
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Dongguan Ziitek Electronic Materials & Technology Ltd.
City: Dongguan
Province/State: Guangdong
Country/Region: China
Contact Person:Miss Dana

Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness

Brand Name : ZIITEK
Model Number : TIF100-40-14S
Certification : UL and RoHs
Place of Origin : China
MOQ : 1000pcs
Price : negotiation
Supply Ability : 100000pcs/day
Delivery Time : 3-5 days
Packaging Details : 1000pcs/bag
Tensile Strength : 40 psi
Thermal conductivity : 4 W/m-K
Hardness : 45 Shore 00
Specific Gravity : 2.50 g/cc
Dielectric Constant : 5.5 MHz
Fire rating : 94-V0
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Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness


The TIF100-40-14S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.



Features:

> Good thermal conductive: 4 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness


Applications:


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)


Typical Properties of TIF100-40-14S Series
Color

Pink

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm

0.48

20mils / 0.508 mm

0.56

Specific Gravity

2.50 g/cc

ASTM D297

30mils / 0.762 mm

0.71

40mils / 1.016 mm

0.80

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

0.91

60mils / 1.524 mm

0.94

Hardness
45 Shore 00ASTM 2240

70mils / 1.778 mm

1.05

80mils / 2.032 mm

1.15

Tensile Strength

40 psi

ASTM D412

90mils / 2.286 mm

1.25

100mils / 2.540 mm

1.34

Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.43

120mils / 3.048 mm

1.52

Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.63

140mils / 3.556 mm

1.71

Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

1.81

160mils / 4.064 mm

1.89
Volume Resistivity
7.8X10" Ohm-meterASTM D257

170mils / 4.318 mm

1.98

180mils / 4.572 mm

2.07

Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

2.14

200mils / 5.080 mm

2.22

Thermal conductivity
4 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Standard Thicknesses:
0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm) 0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Product Tags:

thermal conductive material

      

cpu thermal pad

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

Cpu Thermal Pad TIF100-40-14S 4.0W/MK For RDRAM Memory Modules , 45 Shore 00 Hardness Images

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